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Package Industry News & PR

BMG exhibits Contact Heat & Robotic Stacking at ChinaPlas 2025

Beaverton, MI (March 10, 2025) – BMG is a global leader in full-service thermoforming packaging and automation technology. This group of highly skilled personnel has historically been the leader in the development and manufacturing of industry-changing improvements for the entire thermoforming end-to-end processes, which has benefitted manufacturers of packaging products for years. BMG continues to engineer innovations that provide its customers with world-class technology solutions, shorter developmental lead times, and outstanding executional design flexibility.

Welcome to ChinaPlas 2025; this year, BMG will showcase its incredible Contact Heat Thermoformers and uniquely adaptable end-of-line automated stacking technologies for all to see up close and personal. One size does not fit all, but BMG has a size that will fit any manufacturing need you may have. Stop by booth #C51 at ChinaPlas in Shenzhen World Exhibition & Convention Center (Bao’an), PR China, No.1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, April 15–18, 2025, to experience the new BMG and its revolutionary thermoforming technologies. If you are interested in all things plastic thermoforming, automation, and sustainability, this is one experience you won’t want to miss.

Efficiency Meets Sustainability

For everybody who wants to hop on the reduced energy consumption train, this BMG product line is in your wheelhouse. The BMG DX series Thermoformers are expertly engineered and developed to meet today’s complex demands for multiple applications of thermoformed APET plastic product needs. These particular design solutions were developed to provide a far greater APET cutting capacity than the other standard Contact-Heat Cut-In-Place industry thermoformers and to exceed industry standards when it comes to creating multifunctional solutions for thermoformed plastic containers.

BMG will be celebrating the launch of its new contact heat cut-in-place GN3625DX Contact Heat Thermoformer and GN3625RSX Robotic Stacker. These engineering marvels will be showcased at booth #C51, highlighting their performance capabilities. These innovations are a key asset for manufacturing food containers, blister packs, automobile components, home electric appliances, and industrial trays. When consumer marketing models demand visible product packaging, clear poly-based solutions like these are essential for safety, crush strength, and versatility in retail environments.

The BMG DX series thermoformers have quickly become the industry choice of customers worldwide who require a larger forming area and cutting capacity to provide maximum part production. All DX machines incorporate servo movements to provide maximum cycle speed and efficiency.

Automation That Performs

Automation is the name of the game when it comes to intuitive technology that can improve your ability to stack, rack, and pack with ease of execution. For case packing, counting, wrapping, and stacking, BMG’s automated systems are the leading food service packaging solutions for full-line material handling and packaging. When designing, engineering, and manufacturing paper and plastic cups, containers, lids, plates, and trays, their integrated robotic platforms bring innovative solutions to material handling challenges through application or design-specific end-of-arm tools, ‘smart’ change-out tooling, and expert robot simulation.

If you are wondering if BMG’s robotic stacking tech is all it’s stacked up to be, then come by their booth and experience this technology firsthand. Representatives for these automated manpower-saving solutions will be on hand so you can get all of your questions answered.

“Many of our new advancements in technology focus on automation. One of our main drivers in engineering new manufacturing solutions is to constantly allow for production improvements with automated applications to see how we can assist customers in creating a more profitable process while addressing manpower and safety issues. We are constantly looking towards the future and engineer smarter,” said BMG COO/CIO Jake Kowalewski.

You won’t want to miss this opportunity to feast your eyes on these new product offerings for plastic thermoforming innovations. Stop by their booth #C51, and they will answer all of your questions about thermoforming, the process, the solutions, and the avenues to travel down to get the best possible outcome for your plastic packaging and automation needs.

In order to lead an industry, you have to create advancements in technology that allow manufacturers down the line to engineer unique solutions for their customers. Incredible market growth and key market indicators have paved the way for BMG to introduce an enhanced manufacturing process across various sectors, including food, medical, electronics, horticulture, and ancillary packaging. Be sure to visit their booth to explore and learn more about these advancements, which are detailed and showcased comprehensively. Advancements in technology and new patents have led to significant improvements in fit characteristics and sustainability, which are driven by their engineering process improvements.

BMG remains steadfast in its dedication to supporting customers seeking thermoforming packaging and automation solutions. With a keen focus on detail, BMG delivers comprehensive end-to-end solutions, prioritizing shorter development timelines, enhanced ROI, reduced operational costs, and unmatched global service commitment.

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